Wire Bonding

The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop height.

VIEW Engineering’s proven Pinnacle, Benchmark, and Summit metrology solutions, with advanced optics and laser options, provide the robust and configurable platforms needed for implementation of near in-line production-oriented wire bonding inspection.